| 摘要 |
The present invention relates to technology for semiconductor package. More particularly, the present invention relates to a method for attaching a clip to a semiconductor chip and multi-clip mounting equipment used for the same. The arrangement pitch of the clip arranged in a clip frame is smaller than the arrangement pitch of semiconductor chips arranged in a lead frame. Some of the clips arranged in the clip frame are sequentially cut into individual clips. They are transferred. After that, the individual clips are rearranged so that the arrangement pitch of the individual clips is the same as the arrangement pitch of the semiconductor chips arranged in the lead frame. The individual clips are attached onto the semiconductor chips. Therefore, the cutting of the clip is easily carried out. Also, the density of the clip arranged in the clip frame is maximized. Manufacturing costs can be reduced. |
