Computer system component bay

摘要

An apparatus includes a component bay having an operational height and an expanded height. The component bay is moveable between the operational height and the expanded height. A thermal element divides the component bay into one or more compartments, each compartment configured to receive a system component. The component bay at the operational height provides thermal contact between the received system component and the thermal element.

主权项

1. An apparatus for containing computer system components, the apparatus comprising:
a component bay having an operational height and an expanded height, the component bay moveable between the operational height and the expanded height; a thermal element dividing the component bay into two compartments, each of the two compartments configured to receive a system component, wherein the component bay at the operational height provides thermal contact between the received system components and the thermal element; wherein the component bay contains scissor structures on opposing sides of the component bay, the scissor structures providing movement of the component bay between the operational height and the expanded height, a frame module supporting the component bay; and a frame unit configured to support the frame module, wherein the frame module configured to move between a first position and a second position, the first position within the frame unit, the second position at least partially removed from the frame unit.