Method of manufacturing semiconductor device

摘要

To protect a plurality of semiconductor chips of a sawn wafer housed in a shipping case.;A method of manufacturing a semiconductor device includes a step of vacuum packing a sawn wafer while being housed in a shipping case. The shipping case has the following structure. The shipping case has a lid portion that covers the upper surface of the sawn wafer and a body portion that covers the lower surface of the sawn wafer. The lid portion has a recess portion that covers a plurality of semiconductor chips and a ventilation route communicated with the recess portion. In a step of reducing pressure in the shipping case, a gas in the shipping case is discharged outside via a ventilation route.

主权项

1. A method of manufacturing a semiconductor device, comprising the steps of:
(a) providing a substrate having a first main surface and a second main surface on the side opposite to the first main surface and forming a plurality of semiconductor elements over the first main surface of the substrate to form a semiconductor wafer; (b) providing an annular ring to which an adhesive tape has been attached; (c) attaching the semiconductor wafer onto the adhesive tape so that the second main surface of the semiconductor wafer faces the adhesion surface of the adhesive tape located in the ring; (d) dicing the semiconductor wafer into a plurality of semiconductor chips to form a sawn wafer in which the plurality of semiconductor chips are retained by the ring while being attached to the adhesive tape; (e) after the step (d), housing the sawn wafer in a shipping case having a first case portion that covers a first surface of the sawn wafer to which the semiconductor chips have been attached and a second case portion that covers a second surface of the sawn wafer on the side opposite to the first surface and thereby fixing the ring; (f) after the step (e), housing the shipping case in a shipping bag; and (g) after the step (f), sucking a gas from the shipping bag to reduce a pressure in the shipping case, wherein the first case portion has, in the step (e), a first recess portion that covers the semiconductor chips and a first ventilation route communicated with the first recess portion and coupled to an external space of the shipping case; wherein the second case portion has, in the step (e), a second recess portion that covers the second surface of the sawn wafer; and wherein in the step (g), a gas is discharged from the shipping case via the first ventilation route.