| 发明名称 | Array substrate and manufacturing method thereof | ||
| 摘要 | Embodiments of the invention provide an array substrate comprising a plurality of pixel units, each of the pixel units including a first display electrode, a second display electrode and an insulating portion, wherein, the insulating portion comprises a plurality of first via holes; the first display electrode is disposed at a surface of the insulating portion, and the second display electrode is disposed at bottom surfaces of the first via holes. Embodiments of the invention further provide a method for manufacturing the array substrate. | ||
| 申请公布号 | US9324742(B2) | 申请公布日期 | 2016.04.26 |
| 申请号 | US201313975972 | 申请日期 | 2013.08.26 |
| 申请人 | BOE TECHNOLOGY GROUP CO., LTD.;BEIJING BOE DISPLAY TECHNOLOGY CO., LTD. | 发明人 | Feng Bin;Lin Hongtao;Wang Zhangtao;Shao Xibin |
| 分类号 | H01L27/12;G02F1/1343 | 主分类号 | H01L27/12 |
| 代理机构 | Ladas & Parry LLP | 代理人 | Ladas & Parry LLP |
| 主权项 | 1. An array substrate, comprising a plurality of pixel units, each of the pixel units including a first display electrode, a second display electrode and an insulating portion, wherein, the insulating portion comprises a plurality of first via holes; the first display electrode is disposed at a surface of the insulating portion, and the second display electrode is disposed at bottom surfaces of the first via holes; an inner wall of each of the first via holes is perpendicular to its bottom surface. | ||
| 地址 | Beijing CN | ||