POWER SEMI-CONDUCTOR AND METHOD FOR MANUFACTURING THE SAME

摘要

A power semiconductor module according to an embodiment of the present invention includes a first device; a second device which is separated from the first device by a constant distance; a second assembly terminal which is fixed to be contact with an outer surface of the first device and the second device and becomes one connection terminal; and a first assembly terminal which is fixed to be in contact between the first device and the second device and becomes the other connection terminal. The power semiconductor module can directly connect internal devices by a clip-type terminal.