发明名称 Microphone module for electronic device
摘要 A microphone module for an electronic device is provided. The microphone module includes a window having at least one microphone hole in a part of an edge of the window, a microphone installed in a position corresponding to the microphone hole of the window, and a case frame coupled with the window and forming an appearance of the electronic device. The microphone module receives an external voice through the microphone hole of the window.
申请公布号 US9326057(B2) 申请公布日期 2016.04.26
申请号 US201314052111 申请日期 2013.10.11
申请人 Samsung Electronics Co., Ltd. 发明人 Lee Jun-Tae
分类号 H04R1/04;H04R1/08;H04M1/03;H04R1/28 主分类号 H04R1/04
代理机构 Jefferson IP Law, LLP 代理人 Jefferson IP Law, LLP
主权项 1. A microphone apparatus for an electronic device, the microphone apparatus comprising: a window having at least one groove in a part of an edge of the window; a microphone installed in a position corresponding to the at least one groove of the window; a case frame coupled with the window and forming an appearance of the electronic device; and a bracket interposed between the window and the microphone, wherein the bracket comprises a first surface for installing the microphone, a second surface facing the first surface and getting in surface contact with an inner surface of the window, a through-hole passing from a position in which the microphone of the first surface is installed, to the second surface, and a wave guide groove provided to communicate from the through-hole to at least one microphone hole, wherein, when the at least one groove of the window is coupled with the case frame, the at least one microphone hole is disposed between the window and the case frame, wherein the microphone apparatus houses an external voice through the at least one microphone hole of the window, and wherein the inner surface of the window and the wave guide groove in the second surface of the bracket form a passage intersecting the at least one microphone hole and the through-hole.
地址 Suwon-si KR