发明名称 Power supplying module for contactless power supplying device, method for using power supplying module of contactless power supplying device, and method for manufacturing power supplying module of contactless power supplying device
摘要 Coil units equipped with primary coils having the same specification are provided in a power feeding module. Coil-unit intermeshing recess sections are formed on a printed circuit board to match each of the coil units. Pads for joining together with electrodes formed on the coil units are formed on the bottom faces of each of the coil-unit intermeshing recess sections. A plurality of coil units can be mounted onto the printed circuit board easily, by fitting each of the coil units into each of the coil-unit intermeshing recess sections and joining them together, which will enable manufacturing efficiency to be improved.
申请公布号 US9325386(B2) 申请公布日期 2016.04.26
申请号 US201213823975 申请日期 2012.01.11
申请人 Panasonic Intellectual Property Management Co., Ltd. 发明人 Abe Hideaki;Yagyu Hiroyuki;Tanaka Wataru;Abe Shinichi
分类号 H02J17/00;H04B5/00;H05K13/04;H01F38/14 主分类号 H02J17/00
代理机构 Renner, Otto, Boisselle & Sklar, LLP 代理人 Renner, Otto, Boisselle & Sklar, LLP
主权项 1. A power supplying module for a contactless power supplying device, the power supplying module comprising: a plurality of coil units, wherein each of the coil units includes a primary coil and one or more first terminals, and when the primary coil is excited and a secondary coil of a device is arranged adjacent to the primary coil, secondary power is generated by electromagnetic induction at the secondary coil, and the secondary power is supplied to a load of the device; and a printed wiring substrate including a plurality of first layout regions respectively defined for arrangement of the coil units, wherein each of the first layout regions includes one or more second terminals for connection to the one or more first terminals of the corresponding coil unit, andone or more wires formed on the printed wiring substrate to drive the coil unit arranged in each of the first layout regions; wherein the coil units are arranged on the printed wiring substrate by arranging the coil units in the first layout regions of the printed wiring substrate and connecting the one or more second terminals of each first layout region to the one or more first terminals of each coil unit, wherein each of the first layout regions formed on the printed wiring substrate is a coil unit fitting recess into which the coil unit is fitted; and each of the coil unit fitting recesses includes a bottom surface, andthe one or more second terminals formed on the bottom surface of each of the coil unit fitting recesses and jointed to the one or more first terminals of the coil unit that is fitted.
地址 Osaka JP