| 摘要 |
PROBLEM TO BE SOLVED: To suppress poor bonding due to bumps.SOLUTION: A semiconductor device includes: a first substrate; a plurality of first conductive pads provided on the first substrate; a second substrate having at least a semiconductor substrate and provided so as to face the first substrate across the first conductive pads; a plurality of second conductive pads provided on the second substrate so as to be positioned between the first substrate and the second substrate; an insulating adhesive layer for sealing between the first substrate and the second substrate; and a plurality of bumps penetrating the insulating adhesive layer and electrically connecting the plurality of first conductive pads and the plurality of second conductive pads. The plurality of bumps include at least a first bump having a first height and a second bump which is provided at a position closer to the center of the second substrate than the first bump and has a second height higher than the first height.SELECTED DRAWING: Figure 1 |
