| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for coating an electronic component having a substrate including irregularities, without conducting a current between an electronic component having conductivity on the surface and an electromagnetic shielding layer, while thinning a substrate and enhancing the design flexibility thereof.SOLUTION: A film for electromagnetic shielding used for coating irregularities on a substrate includes an isolating layer and an electromagnetic shielding layer laminated on one side thereof, where the piercing strength of the isolating layer measured according to JIS Z 1707 is 0.90-10.0 N. A protective layer is laminated on the opposite side of the isolating layer via the electromagnetic shielding layer, and the isolating layer is preferably composed of a thermoplastic insulation resin.SELECTED DRAWING: Figure 2 |
