| 摘要 |
PROBLEM TO BE SOLVED: To inhibit generation of an undivided region in the case where an expandable tape is expanded and an adhesive layer is divided in a state where a plurality of semiconductor components are attached to the expandable tape via the adhesive layer.SOLUTION: A semiconductor manufacturing apparatus comprises: an expanded ring pressed to a processed body so as to overlap an expandable tape; a pressure ring which has a hollow part, for pressing a wafer ring in a manner such that at least a plurality of semiconductor components are exposed on the hollow part; and a drive mechanism for lifting up/down at least one of the processed body and the expanded ring so as to make a difference between heights of the wafer ring and the expanded ring to expand the expandable tape. An outer periphery of the expandable ring or an inner periphery of the pressure ring has a shape with a width smaller in a second direction orthogonal to a first direction compared with a width in the first direction.SELECTED DRAWING: Figure 1 |
