| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal base substrate combining suppression of interlayer peeling and high heat dissipation.SOLUTION: A metal base substrate 1 is formed laminating and bonding a clad material 30, where an aluminum plate 31 and a copper plate 32 are bonded, in addition to a copper foil 10 and a resin material 20. In the clad material 30, the surface exposing the aluminum plate 31 is bonded to the resin material 20. Since the difference of thermal expansion coefficient of aluminum and resin is small compared with that of copper and resin, peeling at the bonding part of the resin material 20 and clad material 30 can be suppressed. Furthermore, since the surface of the clad material 30 where the copper plate 32 is exposed is an open surface, high heat dissipation by copper having high heat conductivity can be obtained. Consequently, suppression of interlayer peeling and high heat dissipation can be combined in a metal base substrate 1.SELECTED DRAWING: Figure 1 |
