发明名称 SOLUBLE ANODE FOR Sn ALLOY ELECTROLYSIS PLATING
摘要 PROBLEM TO BE SOLVED: To provide a soluble anode for Sn alloy electrolysis plating capable of providing metal ions of Sn and an additive component thereof from an anode when Sn alloy such as Sn-Ag-based alloy and Sn-Cu-based alloy are electrolysis plated.SOLUTION: In a soluble anode for Sn alloy electrolysis plating 1, a first anode body 2 consisting of Sn and a second anode body 3 consisting of an additive component of the Sn alloy are laminated alternately for covering a whole area each other and an outer peripheral surface and an inner peripheral surface of the laminate are covered by an encapsulation body 4, the second anode body 3 exposed to a top face of both anode bodies is eluted, then the first anode body 2 is eluted as the first anode body 2 is exposed when elution of the second anode body 3 is finished.SELECTED DRAWING: Figure 1
申请公布号 JP2016060938(A) 申请公布日期 2016.04.25
申请号 JP20140189207 申请日期 2014.09.17
申请人 MITSUBISHI MATERIALS CORP 发明人 HATTA KENJI
分类号 C25D17/12;C25D17/10 主分类号 C25D17/12
代理机构 代理人
主权项
地址