发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device of high breakdown voltage.SOLUTION: A semiconductor device of an embodiment comprises: a silicon substrate; a multilayer film which is provided on the silicon substrate and has a first aluminum nitride-containing layer, a second aluminum nitride-containing layer and a lamination film in which at least two layers out of aluminum nitride-containing layers, gallium nitride-containing layers and aluminum gallium-containing layers are alternately laminated one by one from the first aluminum nitride-containing layer toward the second aluminum nitride-containing layer to forma a super lattice; and a first gallium nitride-containing layer provided on the multilayer film.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016062987(A) |
申请公布日期 |
2016.04.25 |
申请号 |
JP20140188005 |
申请日期 |
2014.09.16 |
申请人 |
TOSHIBA CORP |
发明人 |
ISOBE YASUHIRO;SUGIYAMA NAOJI |
分类号 |
H01L21/338;H01L21/336;H01L29/778;H01L29/78;H01L29/812 |
主分类号 |
H01L21/338 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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