发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device of high breakdown voltage.SOLUTION: A semiconductor device of an embodiment comprises: a silicon substrate; a multilayer film which is provided on the silicon substrate and has a first aluminum nitride-containing layer, a second aluminum nitride-containing layer and a lamination film in which at least two layers out of aluminum nitride-containing layers, gallium nitride-containing layers and aluminum gallium-containing layers are alternately laminated one by one from the first aluminum nitride-containing layer toward the second aluminum nitride-containing layer to forma a super lattice; and a first gallium nitride-containing layer provided on the multilayer film.SELECTED DRAWING: Figure 1
申请公布号 JP2016062987(A) 申请公布日期 2016.04.25
申请号 JP20140188005 申请日期 2014.09.16
申请人 TOSHIBA CORP 发明人 ISOBE YASUHIRO;SUGIYAMA NAOJI
分类号 H01L21/338;H01L21/336;H01L29/778;H01L29/78;H01L29/812 主分类号 H01L21/338
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