发明名称 BORON NITRIDE AGGLOMERATE AND THERMALLY CONDUCTIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a thermally conductive composition, a heat dissipation grease, a paste, a pad, a sheet, and a film having dramatically improved thermal conductivity in heat transfer direction.SOLUTION: The present invention provides a boron nitride agglomerate with an oxygen content of less than 0.1 mass% and a thermally conductive composition comprising 50 mass% or more of the boron nitride agglomerate as a filler in a matrix.SELECTED DRAWING: None
申请公布号 JP2016060680(A) 申请公布日期 2016.04.25
申请号 JP20140191654 申请日期 2014.09.19
申请人 SHIN ETSU CHEM CO LTD 发明人 SHIONO YOSHIYUKI
分类号 C01B21/064;C08K3/38;C08L83/04 主分类号 C01B21/064
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