| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition having characteristics such as storage stability as a composition and characteristics such as solder heat resistance as a solder resist and also having a high reflectance, and a dry film, a cured product, and a printed wiring board.SOLUTION: The curable resin composition comprises (A) a curable resin, (B) a white colorant, and (C) a surface-treated photo-excitable inorganic filler. When the curable resin composition before cured is subjected to the following process of supplying 10 g of the composition to 50 g of acetone to extract a primary insoluble component therefrom, supplying the extracted primary insoluble component to 50 g of chloroform to extract a secondary insoluble component, and further supplying the extracted secondary insoluble component to 10 g of pure water and stirring at 30°C for one week to obtain a liquid. The obtained liquid has a pH of 6 to 12.SELECTED DRAWING: Figure 1 |
