| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device and an electrostatic chuck control method which enable the decrease in frequency of replacement of an electrostatic chuck.SOLUTION: A plasma processing device 1 according to an embodiment, which is a semiconductor manufacturing device, comprises: an electrostatic chuck 3; and a control part 12. The electrostatic chuck 3 has an electrode 9. The electrode 9 serves to produce an electrostatic force. On the electrostatic chuck 3, a wafer 6 which is a workpiece is placed. The workpiece is stuck by the electrostatic force. The control part 12 controls a voltage supplied to the electrode 9. The control part 12 controls the voltage according to the change in the force for sticking the workpiece to the electrostatic chuck 3, which accompanies a process on the workpiece placed on the electrostatic chuck 3.SELECTED DRAWING: Figure 1 |
