| 摘要 |
PROBLEM TO BE SOLVED: To provide a beam lead and a semiconductor device capable of reducing a stress added to a junction part between the beam lead and an electrical element when a temperature of the beam lead is changed.SOLUTION: A beam lead (11) for connecting between electrical elements (7, 9) arranged on a substrate (3) is configured by a conductive member (20) formed by folding and processing a plurality of twisted wires (L) each consisting of an insulation-coated and flexible thin metallic wire.SELECTED DRAWING: Figure 1 |
