| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which allows easy manufacturing and downsizing.SOLUTION: A semiconductor device 1 comprises: a semiconductor substrate 10; an insulating member 11 provided in a first region Rs on the semiconductor substrate; an insulation film 12 which is provided in a second region Ra on the semiconductor substrate where the insulating member is not provided and which has a top face lower than a top face of the insulating member; a conductive member 13 provided on the insulating member and on the insulation film; and two vias 14a, 14b connected to the conductive member 13. An upper part 13b of the conductive member 13 is provided in both of the first region Rs and the second region Ra and a lower part 13a of the conductive member 13 is provided in the second region Ra and is not provided in the first region Rs. In the conductive member 13, the route from a portion where the one via is connected to a portion where the other via is connected traverses at least one place of the first region Rs.SELECTED DRAWING: Figure 3 |
