发明名称 COMPOSITION FOR FORMING FILM, FILM, METHOD FOR MANUFACTURING PATTERNED SUBSTRATE, AND COMPOUND
摘要 PROBLEM TO BE SOLVED: To provide a composition for forming a film, from which such a resist underlay film can be formed that has excellent heat resistance and flatness while maintaining etching durability.SOLUTION: The composition for forming a film comprises a compound having a partial structure represented by formula (1) and a solvent. In the formula, Rto Reach independently represent a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms; n1 and n2 each independently represent an integer of 0 to 2; b1 and b2 each independently represent an integer of 0 to 4; k1 and k2 each independently represent an integer of 0 to 9; and the above compound preferably has a group that forms an intermolecular bond.SELECTED DRAWING: None
申请公布号 JP2016060886(A) 申请公布日期 2016.04.25
申请号 JP20140192000 申请日期 2014.09.19
申请人 JSR CORP 发明人 NAKAFUJI SHINYA;WAKAMATSU TAKASHI;ABE TSUBASA;SAKAI KAZUNORI
分类号 C09D201/00;C09D7/12;C09D171/08;G03F7/11;H01L21/027 主分类号 C09D201/00
代理机构 代理人
主权项
地址