| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for encapsulating an optical semiconductor that solidifies at normal temperature and is capable of achieving both of low moisture absorption and high strength when hardening.SOLUTION: The epoxy resin composition for encapsulating an optical semiconductor contains (A) a bisphenol type epoxy resin having the softening temperature of 70°C or more, (B) a bisphenol type epoxy resin which is liquid at normal temperature, (C) an acid anhydride hardening agent and (D) a hardening accelerator as essential components. The (A) bisphenol type epoxy resin having the softening temperature of 70°C or more is contained at 20 to 65 mass% based on the total of the epoxy resin component. The (B) bisphenol type epoxy resin which is liquid at normal temperature is contained at 35 to 80 mass% based on the total of the resin component.SELECTED DRAWING: None |
