| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a connection structure by which a component excluding solder particles in conductive paste can be prevented from being spread excessively and further the solder particles can be efficiently disposed between electrodes.SOLUTION: The manufacturing method of a connection structure includes the steps of: disposing the conductive paste on a surface of a first connection target member; disposing a second connection target member on a surface of the conductive paste in such a manner that a first electrode and a second electrode face each other; and heating the conductive paste to a fusing point of the solder particles or higher and a curing temperature of a thermally curable component or higher to electrically connect the first electrode and the second electrode by a solder part in a connection part. As the first connection target member, a first connection target member including a projection in a region where the first electrode is not provided, in a lateral part of an entire area in which the first electrode is provided, on the surface closer to the first electrode is used.SELECTED DRAWING: Figure 1 |
