| 摘要 |
PROBLEM TO BE SOLVED: To suppress decrease in an amount of unevenness of a substrate appearing on a film surface on which an image has been formed, in comparison with a case in which no means to laminate a first film after peeling of a second film exists, in a configuration which has the first film with the image formed thereon and the second film in close contact with the side opposite to the image on the first film.SOLUTION: A laminating apparatus 10 has a peeling part 14 to peel off a second film 46 from a film material 42, and a laminating part 30 to heat and press a first film 44, from which the second film 46 has been peeled off in the peeling part 14, and a substrate 48. Here, because the first film 44 thinner than the second film 46 is brought into close contact with the substrate 48, the surface state of the first film 44 becomes close to the surface state of the substrate 48 when compared with a case in which the thick second film 46 is brought into close contact with the substrate 48. Thereby decrease in an amount of unevenness of the substrate 48 appearing on the surface of a laminate 50 is suppressed.SELECTED DRAWING: Figure 1 |
