SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MANUFACTURING APPARATUS

摘要

PROBLEM TO BE SOLVED: To improve yield of a layered chip and reduce the cost by reducing a positional deviation amount between layered chips.SOLUTION: A semiconductor device manufacturing method according to an embodiment comprises: a process of acquiring a position of a first semiconductor chip; a process of mounting a second semiconductor chip on the first semiconductor chip; a process of acquiring a position of the second semiconductor chip; a process of calculating a first deviation amount which is a deviation amount between the position of the first semiconductor chip and the position of the second semiconductor chip; and a process of performing first determination whether the first deviation amount is within a standard range.SELECTED DRAWING: Figure 6