| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation structure ensuring high degree of freedom in the arrangement of heat dissipation fins and excellent cooling effect, even for a circuit board mounting circuit components of different height, and also ensuring high degree of freedom in the arrangement of connection points of a circuit board and a ground electrode, and to provide a circuit board with a heat dissipation structure, and a television device.SOLUTION: A heat dissipation structure 1 has a heat dissipation member 2 where a base 10 and a plurality of heat dissipation fins 20 are extrusion molded, and an attachment member 3 for fixing the heat dissipation member 2 to a circuit board 4. The base 10 has a recessed portion 11, where the gap width to the circuit board 4 is large, and a projection portion 12 where the gap width is small, in the arrangement direction of the heat dissipation fins 20 depending on the height of the circuit components 51, 52, 53 mounted on the circuit board 4, when the heat dissipation structure 1 is attached to the circuit board 4. The attachment member 3 has an abutment part in contact with the base 10 and a separation part separated from the base 10, and is attached to the recessed portion 11 of the base 10.SELECTED DRAWING: Figure 4 |
