| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation structure of an electronic apparatus which allows for efficient heat dissipation from a heat generating portion of a substrate, while reducing the cost and saving the space.SOLUTION: A heat dissipation structure of an electronic apparatus 1 includes a housing 10, a partition plate 30 coupled with the inside surface 100 of the housing 10 via a coupling member 20, and a first substrate 50 attached to the first surface 300 of the partition plate 30 via a first attachment member 40. The partition plate 30 has a first heat dissipation member 310 protruded from the first surface 300, and the first heat dissipation member 310 abuts against a CPU500, as one example of a heat generating portion of the first substrate 50.SELECTED DRAWING: Figure 5 |
