| 摘要 |
PROBLEM TO BE SOLVED: To provide a resistive element, including an element assembly and a terminal electrode disposed on a surface of the element assembly, capable of suppressing deposition of a component constituting a plating layer on a surface of the element assembly while preventing generation of no deposition of a plating layer on a surface of a terminal electrode, and to provide a manufacturing method thereof.SOLUTION: The resistive element, including an element assembly and a terminal electrode disposed on a surface of the element assembly, is formed with a coating layer derived from alkoxysilane oligomer on the surface of the element assembly except a surface of the terminal electrode.SELECTED DRAWING: Figure 1 |
