| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a flexible device using a polyimide film formed on a carrier substrate, in which the adhesive strength between the carrier substrate and the polyimide film is controlled.SOLUTION: A manufacturing method of a flexible device includes the steps of: forming a polyimide film by streaming a polyamic acid solution on a glass substrate to be imidized by heating treatment; forming a circuit on the polyimide film; and peeling the polyimide film from the glass substrate. In the manufacturing method, the polyamic acid solution contains: a polyamic acid comprising a tetracarboxylic acid component mainly composed of a 3,3',4,4'-biphenyltetracarboxylic acid dianhydride and a diamine component mainly composed of a 4,4'-diaminodiphenyl ether; and a phosphate ester.SELECTED DRAWING: None |
