发明名称 CANDY CHIP PRODUCTION METHOD AND CANDY CHIP
摘要 PROBLEM TO BE SOLVED: To suppress hygroscopic property of pieces of candy formed into small pieces, and hold preferable flavor and crispy texture.SOLUTION: Candy is made by boiling a raw material including sugar as a main raw material, then the boiled candy is crushed for forming into small pieces. On a surface of each small piece-state candy, fat whose melting point is 30-38°C coats with an amount of 4-8 mas% of the small piece-state candy weight, and coats thin. Thereby, the candy chips are produced. In size of pieces of small piece-state candy, pieces of candy having 1-5 mm of diameter, are included by 70 mass% or more.SELECTED DRAWING: Figure 1
申请公布号 JP2016059330(A) 申请公布日期 2016.04.25
申请号 JP20140189641 申请日期 2014.09.18
申请人 SEMBA TOHKA INDUSTRIES CO LTD 发明人 ISHIKAWA TOMOYO;OKUDA TOMOKO;KANESHIMA KENTO
分类号 A23G3/34;A23G1/00;A23G1/30 主分类号 A23G3/34
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