| 摘要 |
PROBLEM TO BE SOLVED: To enhance bonding reliability of each substrate for power module and a heatsink, while ensuring excellent heat dissipation performance, when bonding a plurality of substrates for power modules to one heatsink.SOLUTION: A manufacturing apparatus 50 of the substrate for power module with a heatsink includes compression means 60 for compressing a laminate 25, where a plurality of substrates 10 for power modules are arranged on a heatsink 20 while being superposed, in the lamination direction thereof. The compression means 60 has a plurality of upper compression plates 70 for pressing the surface of the circuit layer 12 on the substrate 10 for power module individually, one lower compression plate 80 for pressing the back of the heatsink 20, and energization means 90 for giving a pressing force to the upper compression plates 70.SELECTED DRAWING: Figure 1 |
