| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can inhibit the occurrence of cracks in a solder.SOLUTION: A semiconductor device comprises a package part 11 in which a semiconductor element is resin sealed, a plurality of first leads 12, a plurality of second leads 13 and a heat sink 14. The plurality of first leads 12 project from one side face 11s1 of the package part 11 and at least a part of each bottom face 12b is almost flush with a bottom face 11b of the package part 11. The plurality of second leads 13 project from the other side face 11s2 of the package part 11 and each bottom face 13b is almost flush with the bottom face 11b of the package part 11. The heat sink 14 is provided on the bottom face 11b of the package part 11 and connected to at least any of the plurality of second leads 13. Each of the plurality of first leads 12 has a length longer than a length of each of the plurality of second leads 13.SELECTED DRAWING: Figure 1 |
