SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To suppress deterioration in reliability of a semiconductor device.SOLUTION: A semiconductor device includes: a chip laminate having a plurality of laminated semiconductor chips; a sealing resin layer for sealing the chip laminate; a first bump layer provided on the chip laminate so as to be buried in the sealing resin layer and having a flat surface exposed from the sealing resin layer along an upper surface of the sealing resin layer; and a second bump layer provided on the flat surface of the first bump layer.SELECTED DRAWING: Figure 1