ELECTRONIC COMPONENT MOUNTING SUBSTRATE AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT MOUNTING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide an electronic component mounting substrate where a metal block is hardly dropped from a base material when the substrate is bent in use.SOLUTION: An electronic component mounting substrate includes: a base material which is made of an insulation resin and includes a first principal surface and a second principal surface opposite to the first principal surface; a first conductor layer which is formed on the first principal surface of the base material; a second conductor layer which is formed on the second principal surface of the base material; a hole that penetrates the first conductor layer, the base material and the second conductor layer; and a metal block that is fitted into the hole. The hole includes a first fitting port closer to the first conductor layer and a second fitting port closer to the second conductor layer. The metal block includes a first protrusion that protrudes from a surface of the first conductor layer, and/or a second protrusion that protrudes from a surface of the second conductor layer. The first protrusion includes a first extension part that spreads so as to cover a periphery of the first fitting port and/or the second protrusion includes a second extension part that spreads so as to cover a periphery of the second fitting port.SELECTED DRAWING: Figure 1