发明名称 |
GROUP III NITRIDE SEMICONDUCTOR LIGHT EMITTING ELEMENT MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a group III nitride semiconductor light emitting element manufacturing method which achieves improvement in positional accuracy between a comb-shaped wiring electrode and a reflection layer with a shape which follows the shape of the wiring electrode.SOLUTION: A group III nitride semiconductor light emitting element manufacturing method comprises: a wiring electrode formation process of forming a first exposed part J1a where a second insulation layer I2a is exposed and a first non-exposed part J1b where the second insulation layer 2a is not exposed; a second insulation layer formation process of etching the first exposed part J1a by using an n wiring electrode N1a and a p wiring electrode P1a as masks to expose a part of an Al layer of a reflection layer R1a to form a second exposed part J2a and not to expose the remaining part of the Al layer of the reflection layer R1a to form a second non-exposed part J2b; and a reflection layer formation process of etching the second exposed part J2a by using the n wiring electrode N1a and the p wiring electrode P1a as masks to remove the second exposed part J2a and leave the second non-exposed part J2b.SELECTED DRAWING: Figure 8 |
申请公布号 |
JP2016063052(A) |
申请公布日期 |
2016.04.25 |
申请号 |
JP20140189373 |
申请日期 |
2014.09.17 |
申请人 |
TOYODA GOSEI CO LTD |
发明人 |
TAKENAKA YASUHIRO;YAMAZAKI HIROSHI;OGATA HIROYUKI |
分类号 |
H01L33/38;H01L33/10 |
主分类号 |
H01L33/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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