发明名称 WAFER PROBER DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a wafer prober device which enhances the accuracy of characteristic inspection, by preventing variation or fluctuation of the characteristics caused by the pressure or temperature.SOLUTION: A stage 105 includes a mounting surface 1 for mounting a wafer, a mounting area 2, a suction part 3 for sucking a wafer, a suction hole 4, a tube connection hole, a first atmosphere open groove 6 for releasing the air between the stage 105 and a wafer into the atmosphere, a coupling part 7, and a first atmosphere connection hole 8. A plane constituted by the upper surface of the stage 105 is the mounting surface 1. The mounting surface 1 is a portion for mounting a wafer in the manufacturing process of a semiconductor. A portion of the mounting surface 1, being covered by the wafer in the mounted state is the mounting area 2.SELECTED DRAWING: Figure 2
申请公布号 JP2016062990(A) 申请公布日期 2016.04.25
申请号 JP20140188132 申请日期 2014.09.16
申请人 DENSO CORP;TOKYO SEIMITSU CO LTD 发明人 UCHIMURA TERUHIKO;MORI KATSUHIKO;MURAKI SHINICHI
分类号 H01L21/66;H01L21/683 主分类号 H01L21/66
代理机构 代理人
主权项
地址