发明名称 THROUGH ELECTRODE SUBSTRATE AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a highly reliable through electrode substrate and a manufacturing method of the same.SOLUTION: The through electrode substrate includes: a first surface; a second surface on the opposite side of the first surface; an insulating substrate on which a through-hole that penetrates the first surface and the second surface is provided; and a through electrode for connecting the first surface and the second surface. An angle made by the first surface and a first side wall of the through-hole is greater than or equal to 91° and less than or equal to 100°. A diameter of the through-hole at the second surface is less than or equal to 1/2 of the thickness of the insulating substrate.SELECTED DRAWING: Figure 2
申请公布号 JP2016063114(A) 申请公布日期 2016.04.25
申请号 JP20140190956 申请日期 2014.09.19
申请人 DAINIPPON PRINTING CO LTD 发明人 KURAMOCHI SATORU
分类号 H01L23/32 主分类号 H01L23/32
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