| 摘要 |
The present invention relates to a system for curing a substrate. In particular, the present invention relates to a system for curing a substrate, configured to perform a curing processing for a metal layer formed on a substrate and a curing processing for an overcoating layer formed to protect the metal layer through a series of continuous process, thereby reducing time, efforts and costs for curing processing a substrate as well as improving efficiency of curing a substrate by configuring processes of curing the metal layer and the overcoating layer with a pre-curing process and a main curing process. The system for curing a substrate of the present invention comprises: a first pre-curing device for heating the substrate formed on a metal layer in a vacuum to pre-cure the metal layer formed on the substrate; a first main curing device for irradiating pulse light with respect to a substrate transferred from the first pre-curing device to cure the metal layer formed on the substrate; a second pre-curing device for pre-curing the overcoating layer formed on the substrate by heating the substrate after inserting the substrate withdrawn from the first main curing device in which the overcoating layer is formed in an overcoating layer forming device; and a second main curing device for supplying hot-air with respect to the substrate transferred from the second pre-curing device to cure the overcoating layer formed on the substrate. |
