METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SPUTTERING DEVICE

摘要

PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device, and to improve the use efficiency of a sputtering device.SOLUTION: When a thin film is deposited on a principal surface of a semiconductor wafer by using a magnetron system sputtering device in which a collimator 50a is installed in a space between the semiconductor wafer installed in a chamber and a target, reduction in wafer in-plane uniformity of the thin film generated with the progress of an integrated used amount of the target is suppressed by making a thickness in a region inside an outer peripheral part of the collimator 50a be thinner than a thickness at the outer peripheral part.SELECTED DRAWING: Figure 2