| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-temperature Pd-free Au-Sn-Ag-based solder alloy being excellent in workability and stress relaxation property, having a melting point around 300°C suited for high-temperature soldering, featuring a low cost brought by a low Au content as less as about 50 mass% or less, having a preferable melting point between an Au-Ge solder alloy and an Au-Sn solder alloy, and having a practically sufficient wettability.SOLUTION: The Au-Sn-Ag-based solder alloy comprises 42.0 mass% or more and 50.0 mass% or less of Sn, 2.0 mass% or more and 9.0 mass% or less of Ag, and a balance being Au except elements inevitably contained therein during production. The Au-Sn-Ag-based solder alloy may further comprise any one or more of Al, Cu, Ge, In, Mg, Ni, Sb, Zn, and P.SELECTED DRAWING: Figure 1 |
