| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser processing method which allows laser processing without damaging an adhesive tape to which a workpiece is attached.SOLUTION: A laser processing method using a laser processing device which includes workpiece holding means for holding a workpiece (semiconductor wafer 10), laser beam irradiation means of irradiating laser beams on the workpiece and processing feed means of relatively feeding the workpiece holding means and the laser beam irradiation means for processing comprises a laser processing process of performing laser processing on the workpiece by attaching an adhesive tape to the workpiece and attaching an outer periphery of the adhesive tape to an annular frame, and holding the workpiece on a holding surface of the workpiece holding means via the adhesive tape, and actuating the processing feed means to perform processing feed while actuating the laser beam irradiation means to irradiate laser beams on the workpiece, in which heating of the adhesive tape by jetting a coolant gas on a region where the laser beams are irradiated by coolant gas jetting means 6.SELECTED DRAWING: Figure 5 |
