发明名称 PRODUCTION METHOD OF COPPER THREE-DIMENSIONAL NANOSTRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a metallic film having an extremely large specific surface area and a rough surface structure, and a suitable production method of the metallic film.SOLUTION: A production method of a copper three-dimensional nanostructure comprises a step of forming the copper three-dimensional nanostructure by electrolytic plating so that a copper tabular electrodeposit has a crossing with the adjacent copper tabular electrodeposit in a random direction. The sparse density of the tabular electrodeposit is controlled by adjusting the current density when the electrolytic plating is applied. Polyacrylic acid is used as an additive to be added to a plating bath to be used when the electrolytic plating is applied. The concentration c of the polyacrylic acid in the plating bath is set within a range of 2×10M<c<2×10M.SELECTED DRAWING: Figure 4
申请公布号 JP2016056401(A) 申请公布日期 2016.04.21
申请号 JP20140182989 申请日期 2014.09.09
申请人 SHINSHU UNIV 发明人 ARAI SUSUMU
分类号 C25D21/12;B82Y30/00;B82Y40/00;C25D3/38;C25D7/00 主分类号 C25D21/12
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