Methods of Cooling Packaged Semiconductor Devices

摘要

Packages for semiconductor devices, packaged semiconductor devices, and methods of cooling packaged semiconductor devices are disclosed. In some embodiments, a package for a semiconductor device includes a substrate including a semiconductor device mounting region, a cover coupled to a perimeter of the substrate, and members disposed between the substrate and the cover. The package includes partitions, with each partition being disposed between two adjacent members. The package includes a fluid inlet port coupled to the cover, and a fluid outlet port coupled to one of the partitions.

主权项

1. A method of cooling a packaged semiconductor device, the method comprising:
providing a package, wherein the package includes a substrate, a cover coupled to a perimeter of the substrate, a plurality of members disposed between the substrate and the cover, and a plurality of outer partitions, wherein each of the plurality of outer partitions is disposed between two adjacent members of the plurality of members and extends between the substrate and the cover, wherein the package further includes an inlet port coupled to the cover and an outlet port coupled to one of the plurality of outer partitions and further includes a ring member that allows fluid flow between an inner partition that defines a device mounting region and a first one of the plurality of outer partitions and a second portion that prevents fluid flow between the inner partition and a second one of the plurality of outer partitions; coupling a semiconductor device to the device mounting region of the substrate of the package; and passing a fluid from the inlet port of the package and over a top surface of the semiconductor device, through at least one of the plurality of outer partitions, under a bottom surface of the semiconductor device, and to the outlet port of the package.