| 发明名称 |
SEMICONDUCTOR MANUFACTURING APPARATUS |
| 摘要 |
A semiconductor manufacturing apparatus includes: a collet which sucks a semiconductor chip having a main surface on which a bump is formed, and an actuator which transfers the sucked semiconductor chip onto a mounting substrate or another semiconductor chip by driving the collet. A recessed portion for avoiding a contact between the collet and the bump is formed on a suction surface of the collet which sucks the semiconductor chip. |
| 申请公布号 |
US2016111317(A1) |
申请公布日期 |
2016.04.21 |
| 申请号 |
US201514980317 |
申请日期 |
2015.12.28 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
FUKAYAMA Shinya;OYAMA Yukifumi;TSUKIYAMA Satoshi;FUKUDA Masatoshi |
| 分类号 |
H01L21/683;H01L21/677;H01L25/00;H01L23/00 |
主分类号 |
H01L21/683 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor manufacturing method comprising:
positioning a collet including a suction surface having a recessed portion such that a position of the recessed portion corresponds to a position of a bump on a semiconductor chip, the suction surface configured to hold the semiconductor chip having a main surface on which the bump has been formed, the main surface of the semiconductor chip to be held by vacuum suction to the suction surface; and transferring the semiconductor chip onto a mounting substrate or another semiconductor chip by manipulation of the collet, wherein an elastic material having a thickness of about 10 μm to about 50 μm is disposed on the recessed portion. |
| 地址 |
Tokyo JP |
