| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing method and a polishing device, enabling an elastic membrane of a polishing head to be properly swollen when a substrate such as a wafer is separated from the polishing head.SOLUTION: A substrate W is polished while relatively moving a polishing table and a polishing head 1 having a substrate holding surface 4b constituted of an elastic membrane 4 and a pressure chamber. A secondary side valve 37 is closed and a primary side valve 36 is opened, so that fluid having pressure adjusted by a pressure regulator 56 is accumulated in a fluid accumulating element 57, and the primary side valve 36 is closed and the secondary side valve 37 is opened, so that the fluid is supplied to the pressure chamber of the polishing head 1 from the fluid accumulating element 57 to swell the elastic membrane 4, and a clearance is formed between the substrate W and the elastic membrane 4. A release shower composed of the fluid such as pure water is jetted into this clearance from a release nozzle 53, so that the polished substrate W is separated from the polishing head 1.SELECTED DRAWING: Figure 5 |
