MANUFACTURING METHOD OF CERAMIC WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a ceramic wiring board by which exudation of a plating liquid in an Au plating layer and discoloring of the Au plating layer therewith can be suppressed and mountability of electronic components is improved.SOLUTION: A manufacturing method of a ceramic wiring board 1 implements in order: a simultaneous calcination step of forming a substrate body 11 that is formed from ceramic and includes a front face 111 and a rear face 112 and a metalize layer 12 disposed on the front face 111 of the substrate body 11 by means of simultaneous calcination; an Ni plating processing step of forming an Ni plating layer 13 on the metalize layer 12; a Pd plating processing step of forming a Pd plating layer 14 on the Ni plating layer 13; and an Au plating processing step of forming an Au plating layer 15 on the Pd plating layer 14. The Ni plating processing step includes an Ni-P plating processing step of forming an Ni-P plating layer 131 which is included in the Ni plating layer 13 and of which the thickness is 5 μm or more. In the Pd plating processing step, the Pd plating layer 14 is formed on the Ni-P plating layer 131.SELECTED DRAWING: Figure 1