发明名称 WORKPIECE BONDING METHOD
摘要 Provided is a workpiece bonding method that is capable of achieving a high strength bonded state and with which good reproducibility of the bonded state is obtained. This workpiece bonding method for bonding two workpieces, each of which is obtained from a material selected from a group consisting of synthetic resins, glass, silicon wafers, quartz and sapphire, is characterized: in comprising a surface activation step for activing the bonding surface of at least one of the workpieces, and a lamination step for laminating the two workpieces so that the respective bonding surfaces contact each other; and in performing a pre-treatment step for removing moisture from the bonding surfaces of the workpieces submitted to the surface activation step before performing said surface activation step.
申请公布号 WO2016060080(A1) 申请公布日期 2016.04.21
申请号 WO2015JP78767 申请日期 2015.10.09
申请人 USHIO DENKI KABUSHIKI KAISHA 发明人 WASAMOTO, MAKOTO;TAKEMOTO, FUMITOSHI;SUZUKI, SHINJI
分类号 B29C65/02;B29C65/14 主分类号 B29C65/02
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