| 摘要 |
The present invention is a method for preparing a solder resist to be applied on a printed circuit board, and according to the present invention, the method for preparing a solder resist to which a polymer ball coated with aluminum nitride is added comprises the steps of: depositing aluminum nitride on the surface of the polymer ball by sputtering so as to form a filler; and dispersing the filler onto solder resist ink, wherein the step of depositing AIN on the surface of the polymer ball by sputtering comprises the steps of: preparing the polymer ball; pre-treating the polymer ball; and forming an AIN film on the outer cover of the polymer ball by a sputtering process in a vacuum chamber. |
