EPOXY RESIN COMPOSITION FOR ELECTRONIC COMPONENT ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for electronic component encapsulation having poor in adhesiveness with an encapsulation resin and having excellent adhesiveness to a lead frame of which a surface is plated with electrolytic nickel or non-electrolytic nickel or an aluminum-made lead frame.SOLUTION: There is provided an epoxy resin composition for electronic component encapsulation containing a following (E) component with following (A) to (D) components. Also the content of the (E) component is 0.18 to 21.0 wt.% based on the total amount of the (A) component, the (B) component and the (C) component. (A) an epoxy resin. (B) a curing agent. (C) a curing accelerator. (D) an inorganic filler. (E) at least one of carboxylic acid and a derivative thereof, excluding esters as a carboxylic acid derivative.SELECTED DRAWING: None