| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive paste suitable for a printed circuit board where a conductive pattern is formed on a flexible substrate and capable of suppressing peeling or cracking of the conductive pattern due to deformation of the substrate.SOLUTION: There is provided a conductive paste containing a (meth)acrylic block copolymer (A) consisting of a (meth)acrylic polymer block (a) having an active energy ray curable group containing a partial structure (1) represented by the following general formula (1) and a (meth)acrylic polymer block (b) having no active energy ray curable group, (B) a photoinitiator and (C) a conductive filler. (1), where Rrepresents a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms.SELECTED DRAWING: None |
