发明名称 SEMICONDUCTOR DEVICES INCLUDING A GATE CORE AND A FIN ACTIVE CORE AND METHODS OF FABRICATING THE SAME
摘要 Semiconductor devices and methods of fabricating the same are provided. The methods may include forming an isolation region defining a fin active region, forming a sacrificial field gate pattern on the isolation region and forming a sacrificial fin gate pattern on the fin active region. The method may also include forming a field gate cut zone comprising a first recess exposing a surface of the isolation region and a fin active cut zone comprising a second recess exposing a surface of the fin active region, forming a fin active recess in the second recess of the fin active cut zone and forming a field gate core and a fin active core by forming an insulation material in the first recess of the field gate cut zone and the fin active recess, respectively.
申请公布号 US2016111524(A1) 申请公布日期 2016.04.21
申请号 US201514820860 申请日期 2015.08.07
申请人 HA Seungseok;BAI Keunhee;YEO Kyounghwan;PARK Eunsil;SHIN Heonjong 发明人 HA Seungseok;BAI Keunhee;YEO Kyounghwan;PARK Eunsil;SHIN Heonjong
分类号 H01L29/66;H01L21/762 主分类号 H01L29/66
代理机构 代理人
主权项 1. A method of fabricating a semiconductor device, comprising: forming an isolation region defining a fin active region on a substrate; forming a sacrificial field gate pattern on the isolation region and forming a sacrificial fin gate pattern on the fin active region; forming a first interlayer insulating layer between the sacrificial field gate pattern and the sacrificial fin gate pattern; forming a field gate cut zone comprising a first recess exposing a surface of the isolation region by removing a first portion of the sacrificial field gate pattern and a fin active cut zone comprising a second recess exposing a surface of the fin active region by removing a first portion of the sacrificial fin gate pattern; forming a fin active recess by removing the fin active region exposed in the second recess of the fin active cut zone; forming a field gate core and a fin active core by forming an insulation material in the first recess of the field gate cut zone and the fin active recess, respectively; forming a field gate electrode opening by removing a second portion of the sacrificial field gate pattern and forming a fin gate electrode opening by removing a second portion of the sacrificial fin gate pattern; and forming a field gate pattern in the field gate electrode opening and forming a fin gate pattern in the fin gate electrode opening.
地址 Hwaseong-si KR