发明名称 SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
摘要 A semiconductor substrate having a silicon-based substrate, a buffer layer provided on the silicon-based substrate and made of a nitride semiconductor containing boron, and an operation layer formed on the buffer layer, wherein a concentration of boron in the buffer layer gradually decreasing toward a side of the operation layer from a side of the silicon-based substrate. Thereby, the semiconductor substrate in which the buffer layer contains boron sufficient to obtain a dislocation suppression effect and boron is not diffused to the operation layer is provided.
申请公布号 US2016111273(A1) 申请公布日期 2016.04.21
申请号 US201414892034 申请日期 2014.05.02
申请人 SANKEN ELECTRIC CO., LTD. ;SHIN-ETSU HANDOTAI CO., LTD. 发明人 SHIKAUCHI Hiroshi;SATO Ken;GOTO Hirokazu;SHINOMIYA Masaru;TSUCHIYA Keitaro;HAGIMOTO Kazunori
分类号 H01L21/02;H01L29/66;H01L29/15;H01L29/778;H01L29/20;H01L29/205 主分类号 H01L21/02
代理机构 代理人
主权项
地址 Niiaz-shi, Saitama JP